Characterization of epoxy based highly filled die attach materials in microelectronics

I. Maus; C. Liebl; M. Fink; Duc-Khoi Vu; M. Hartung; H. Preu; Kaspar Jansen; B. Michel; B Wunderle; Laurens Weiss

doi:10.1109/EuroSimE.2017.7926237

Characterization of epoxy based highly filled die attach materials in microelectronics

I. Maus, C. Liebl, M. Fink, Duc-Khoi Vu, M. Hartung, H. Preu, Kaspar Jansen, B. Michel, B Wunderle, Laurens Weiss

Emerging Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

Original language	English
Title of host publication	2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Publisher	IEEE
Pages	1-7
Number of pages	7
ISBN (Electronic)	978-1-5090-4344-6
ISBN (Print)	978-1-5090-4345-3
DOIs	https://doi.org/10.1109/EuroSimE.2017.7926237
Publication status	Published - 2017
Event	18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany Duration: 3 Apr 2017 → 5 Apr 2017

Conference

Conference	18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Country/Territory	Germany
City	Dresden
Period	3/04/17 → 5/04/17

Keywords

Temperature measurement
Microassembly
Curing
Material properties
Temperature distribution
Heating Systems

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10.1109/EuroSimE.2017.7926237

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Maus, I., Liebl, C., Fink, M., Vu, D.-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B., & Weiss, L. (2017). Characterization of epoxy based highly filled die attach materials in microelectronics. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 (pp. 1-7). Article 7926237 IEEE. https://doi.org/10.1109/EuroSimE.2017.7926237

@inproceedings{a2c85dd7e7734eb9ad99e9dbb75d0ae0,

title = "Characterization of epoxy based highly filled die attach materials in microelectronics",

abstract = "In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.",

keywords = "Temperature measurement, Microassembly, Curing, Material properties, Temperature distribution, Heating Systems",

author = "I. Maus and C. Liebl and M. Fink and Duc-Khoi Vu and M. Hartung and H. Preu and Kaspar Jansen and B. Michel and B Wunderle and Laurens Weiss",

year = "2017",

doi = "10.1109/EuroSimE.2017.7926237",

language = "English",

isbn = "978-1-5090-4345-3 ",

pages = "1--7",

booktitle = "2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017",

publisher = "IEEE",

address = "United States",

note = "18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 03-04-2017 Through 05-04-2017",

}

Maus, I, Liebl, C, Fink, M, Vu, D-K, Hartung, M, Preu, H, Jansen, K, Michel, B, Wunderle, B & Weiss, L 2017, Characterization of epoxy based highly filled die attach materials in microelectronics. in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017., 7926237, IEEE, pp. 1-7, 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017, Dresden, Germany, 3/04/17. https://doi.org/10.1109/EuroSimE.2017.7926237

Characterization of epoxy based highly filled die attach materials in microelectronics. / Maus, I.; Liebl, C.; Fink, M. et al.
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, 2017. p. 1-7 7926237.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Characterization of epoxy based highly filled die attach materials in microelectronics

AU - Maus, I.

AU - Liebl, C.

AU - Fink, M.

AU - Vu, Duc-Khoi

AU - Hartung, M.

AU - Preu, H.

AU - Jansen, Kaspar

AU - Michel, B.

AU - Wunderle, B

AU - Weiss, Laurens

PY - 2017

Y1 - 2017

N2 - In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

AB - In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

KW - Temperature measurement

KW - Microassembly

KW - Curing

KW - Material properties

KW - Temperature distribution

KW - Heating Systems

UR - http://www.scopus.com/inward/record.url?scp=85020222784&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2017.7926237

DO - 10.1109/EuroSimE.2017.7926237

M3 - Conference contribution

AN - SCOPUS:85020222784

SN - 978-1-5090-4345-3

SP - 1

EP - 7

BT - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

PB - IEEE

T2 - 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

Y2 - 3 April 2017 through 5 April 2017

ER -

Characterization of epoxy based highly filled die attach materials in microelectronics

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