Characterization of epoxy based highly filled die attach materials in microelectronics

I. Maus, C. Liebl, M. Fink, Duc-Khoi Vu, M. Hartung, H. Preu, Kaspar Jansen, B. Michel, B Wunderle, Laurens Weiss

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

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Mathematics

Engineering & Materials Science