Fingerprint
Dive into the research topics of 'Characterization of epoxy based highly filled die attach materials in microelectronics'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Characterization of epoxy based highly filled die attach materials in microelectronics
I. Maus, C. Liebl, M. Fink, Duc-Khoi Vu, M. Hartung, H. Preu, Kaspar Jansen, B. Michel, B Wunderle, Laurens Weiss
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
1
Citation
(Scopus)