Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

M Bartek; SM Sinaga; P Mendes; JH Correia; JN Burghartz

Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

M Bartek, SM Sinaga, P Mendes, JH Correia, JN Burghartz

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings ASDAM 2004
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	227-230
Number of pages	4
ISBN (Print)	0-7803-8535-7
Publication status	Published - 2004
Event	2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia - Piscataway Duration: 17 Oct 2004 → 21 Oct 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia
Period	17/10/04 → 21/10/04

Bibliographical note

ed. is niet bekend

Keywords

Elektrotechniek
conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{889b9474ad6a4ed9884ed5bae2ad6358,

title = "Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives",

keywords = "Elektrotechniek, conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Bartek and SM Sinaga and P Mendes and JH Correia and JN Burghartz",

note = "ed. is niet bekend; 2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia ; Conference date: 17-10-2004 Through 21-10-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8535-7",

publisher = "IEEE Society",

pages = "227--230",

booktitle = "Proceedings ASDAM 2004",

}

Bartek, M, Sinaga, SM, Mendes, P, Correia, JH & Burghartz, JN 2004, Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives. in Proceedings ASDAM 2004. IEEE Society, Piscataway, pp. 227-230, 2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia, 17/10/04.

TY - GEN

T1 - Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

AU - Bartek, M

AU - Sinaga, SM

AU - Mendes, P

AU - Correia, JH

AU - Burghartz, JN

N1 - ed. is niet bekend

PY - 2004

Y1 - 2004

KW - Elektrotechniek

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8535-7

SP - 227

EP - 230

BT - Proceedings ASDAM 2004

PB - IEEE Society

CY - Piscataway

T2 - 2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia

Y2 - 17 October 2004 through 21 October 2004

ER -