@inproceedings{889b9474ad6a4ed9884ed5bae2ad6358,
title = "Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives",
keywords = "Elektrotechniek, conference contrib. refereed, Conf.proc. > 3 pag",
author = "M Bartek and SM Sinaga and P Mendes and JH Correia and JN Burghartz",
note = "ed. is niet bekend; 2004 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), Smolenice, Slovakia ; Conference date: 17-10-2004 Through 21-10-2004",
year = "2004",
language = "Undefined/Unknown",
isbn = "0-7803-8535-7",
publisher = "IEEE",
pages = "227--230",
booktitle = "Proceedings ASDAM 2004",
address = "United States",
}