Characterization of moisture properties of polymers for IC packaging

X Ma, KMB Jansen, LJ Ernst, WD van Driel, O van der Sluis, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)

Abstract

In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments.
Original languageUndefined/Unknown
Pages (from-to)1685-1689
Number of pages5
JournalMicroelectronics Reliability
Volume47
Publication statusPublished - 2007

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

Cite this