Characterization of PCB Embedded Package Materials for SiC MOSFETs

Fengze Hou, Wenbo Wang, Tingyu Lin, Liqiang Cao*, G.Q. Zhang, J.A. Ferreira

*Corresponding author for this work

Research output: Contribution to journal › Article › Scientific › peer-review

15 Citations (Scopus)
478 Downloads (Pure)

Fingerprint

Dive into the research topics of 'Characterization of PCB Embedded Package Materials for SiC MOSFETs'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds