Characterization of PCB Embedded Package Materials for SiC MOSFETs

Fengze Hou, Wenbo Wang, Tingyu Lin, Liqiang Cao*, G.Q. Zhang, J.A. Ferreira

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

15 Citations (Scopus)
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Engineering & Materials Science

Chemical Compounds