Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

J. Thijsse, O van der Sluis, JAW van Dommelen, WD van Driel, MGD Geers

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	401-407
Number of pages	7
Journal	Microelectronics Reliability
Volume	48
DOIs	https://doi.org/doi:10.1016/j.microrel.2007.06.003
Publication status	Published - 2007

niet eerder opgevoerd

Keywords

@article{b85555ae530c409a87bcd11e25f7a2fb,

title = "Characterization of semiconductor interfaces using a modified mixed mode bending apparatus",

keywords = "Geen BTA classificatie",

author = "J. Thijsse and {van der Sluis}, O and {van Dommelen}, JAW and {van Driel}, WD and MGD Geers",

note = "niet eerder opgevoerd",

year = "2007",

doi = "doi:10.1016/j.microrel.2007.06.003",

language = "Undefined/Unknown",

volume = "48",

pages = "401--407",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

}

TY - JOUR

T1 - Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

AU - Thijsse, J.

AU - van der Sluis, O

AU - van Dommelen, JAW

AU - van Driel, WD

AU - Geers, MGD

N1 - niet eerder opgevoerd

PY - 2007

Y1 - 2007

KW - Geen BTA classificatie

U2 - doi:10.1016/j.microrel.2007.06.003

DO - doi:10.1016/j.microrel.2007.06.003

M3 - Article

SN - 0026-2714

VL - 48

SP - 401

EP - 407

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -