Characterization of the viscoelastic properties of an epoxy molding compound during cure

M Sadeghinia, KMB Jansen, LJ Ernst

Research output: Contribution to journal › Article › Scientific › peer-review

40 Citations (Scopus)

Original language	English
Pages (from-to)	1711-1718
Number of pages	8
Journal	Microelectronics Reliability
Volume	52
Issue number	8
DOIs	https://doi.org/10.1016/j.microrel.2012.03.025
Publication status	Published - 2012

Keywords

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title = "Characterization of the viscoelastic properties of an epoxy molding compound during cure",

keywords = "CWTS JFIS < 0.75",

author = "M Sadeghinia and KMB Jansen and LJ Ernst",

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TY - JOUR

T1 - Characterization of the viscoelastic properties of an epoxy molding compound during cure

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2012

Y1 - 2012

KW - CWTS JFIS < 0.75

U2 - 10.1016/j.microrel.2012.03.025

DO - 10.1016/j.microrel.2012.03.025

M3 - Article

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VL - 52

SP - 1711

EP - 1718

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 8

ER -