Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

Y Liu, J Zhao, CCA Yuan, GQ Zhang, F Sun

Research output: Contribution to journal › Article › Scientific › peer-review

24 Citations (Scopus)

Original language	English
Pages (from-to)	1754-1759
Number of pages	6
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	4
Issue number	11
DOIs	https://doi.org/10.1109/TCPMT.2014.2358266
Publication status	Published - 2014

Harvest
Published 1-10-2014

Access to Document

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title = "Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering",

author = "Y Liu and J Zhao and CCA Yuan and GQ Zhang and F Sun",

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T1 - Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

AU - Liu, Y

AU - Zhao, J

AU - Yuan, CCA

AU - Zhang, GQ

AU - Sun, F

N1 - Harvest Published 1-10-2014

PY - 2014

Y1 - 2014

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DO - 10.1109/TCPMT.2014.2358266

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VL - 4

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EP - 1759

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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