Co-design of wafer level thin film package assembly

JJM Zaal, F Santagata, WD van Driel, GQ Zhang, JF Creemer, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

An increasing number of semiconductor companies have research programs related to MEMS products. This can be explained by the wide variety of application areas for MEMS, some mechanical MEMS examples are: filters [1], oscillators [2,3], pressure sensors [4], particle detection [5], thermometers [6] and gyroscopes [7]. Many mechanical MEMS operate in vacuum and sealing of the cavity can be obtained by using a wafer level thin film package or zero level package. Such a package consists of a thin film cap, which is released by etching away a sacrificial layer, and a sealing structure. The main advantage of this method towards others such as local assembly is that all caps can be made in one time and the small scale of the sealing. To fit a MEMS into a small (plastic) package the die needs to be processed in several steps. Examples are: wafer thinning and dicing. In earlier research it was shown that wafer thinning is one of the potentially more hazardous assembly processes due to the large mechanical forces exerted on the wafer [8]. This paper presents an extensive DOE to assess the performance of Wafer Level Thin Film Packages (WLTFP¿s) under assembly processes . The influences of the wafer thinning process on a large variety of WLTFP¿s are quantified. A selection of relevant samples is also tested in other key assembly steps like dicing, die-attach and moulding.
Original languageEnglish
Title of host publication12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
EditorsLJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger
Place of PublicationVoisins le Bretonneux, France
PublisherAstefo
Pages1-6
Number of pages6
ISBN (Print)978-1-4577-0106-1
DOIs
Publication statusPublished - 2011
EventEuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria
Duration: 18 Apr 201120 Apr 2011
Conference number: 12

Publication series

Name
PublisherAstefo

Conference

ConferenceEuroSimE 2011
CountryAustria
CityLinz
Period18/04/1120/04/11

Bibliographical note

Proceedings op CD-Rom verschenen

Keywords

  • Elektrotechniek
  • Techniek
  • conference contrib. refereed
  • Conf.proc. > 3 pag

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