Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

DG Yang; G.Q. Zhang; LJ Ernst; ? et al

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

DG Yang, G.Q. Zhang, LJ Ernst, ? et al

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	51st electronic components and technology conference, May 26 - June 1
Editors	P Slota Jr., WJ Howell
Place of Publication	s.l.
Publisher	IEEE
Pages	919-924
Number of pages	6
ISBN (Print)	0-7803-7038-4
Publication status	Published - 2001
Event	51st electronic components and tecjnology conference - s.l. Duration: 26 May 2001 → 1 Jun 2001

Publication series

Name
Publisher	IEEE

Conference

Conference	51st electronic components and tecjnology conference
Period	26/05/01 → 1/06/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{5a9525a05b844ae891f6ed9be6a2e084,

title = "Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "DG Yang and G.Q. Zhang and LJ Ernst and {et al}, ?",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-7038-4",

publisher = "IEEE",

pages = "919--924",

editor = "{P Slota Jr.} and {WJ Howell}",

booktitle = "51st electronic components and technology conference, May 26 - June 1",

address = "United States",

note = "51st electronic components and tecjnology conference ; Conference date: 26-05-2001 Through 01-06-2001",

}

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties. / Yang, DG; Zhang, G.Q.; Ernst, LJ et al.
51st electronic components and technology conference, May 26 - June 1. ed. / P Slota Jr.; WJ Howell. s.l.: IEEE, 2001. p. 919-924.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

AU - Yang, DG

AU - Zhang, G.Q.

AU - Ernst, LJ

AU - et al, ?

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-7038-4

SP - 919

EP - 924

BT - 51st electronic components and technology conference, May 26 - June 1

A2 - P Slota Jr., null

A2 - WJ Howell, null

PB - IEEE

CY - s.l.

T2 - 51st electronic components and tecjnology conference

Y2 - 26 May 2001 through 1 June 2001

ER -