Abstract
This paper compares the indirect cooling method using a heatpipe and air-cooled circular fins with conventional cooling methods like forced air convection and forced water convection for cooling power electronics placed underground. A two-module dual active bridge power converter with reconfigurable outputs for electric vehicle charging is used for the thermal analysis. The comparison is based on specific constraints imposed by semiconductor switch surface area requirements and the maximum junction temperature limit. A detailed analysis is presented, and performance parameters like convective resistance, pressure drop, and mechanical pumping power of the cooling systems as the function of volume flow of working fluid are obtained. Commercially available cooling components like extruded fin heatsinks, cold plate, and heat exchanger are used for conventional cooling methods analysis. Whereas indirect cooling using heatpipes and air-cooled circular fins is designed by performing individual analysis on a heatpipe sizing, air-cooled circular fin design, and heatpipe integrated base plate. This work also highlights the equivalent thermal resistance model for each cooling system.
Original language | English |
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Title of host publication | Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024 |
Publisher | IEEE |
ISBN (Electronic) | 9798350364330 |
DOIs | |
Publication status | Published - 2024 |
Event | 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024 - Denver, United States Duration: 28 May 2024 → 31 May 2024 |
Publication series
Name | InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM |
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ISSN (Print) | 1936-3958 |
Conference
Conference | 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024 |
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Country/Territory | United States |
City | Denver |
Period | 28/05/24 → 31/05/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Heatpipes
- thermal analysis of power electronics
- thermal management
- thermal resistance
- underground power electronics