Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

AJ Kalkman, AH Verbruggen, GCAM Janssen, JP Lokker, S Radelaar

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

    Original languageUndefined/Unknown
    Title of host publicationMaterials Research Society
    EditorsJKR Cheung, K Tsubouchi, M Murakami, N Kobayashi
    Number of pages5
    Publication statusPublished - 1998

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