@inproceedings{4501c99272d84a6ebc612986e990e2b1,
title = "Comparison of via-fabrication techniques for through-wafer electrical interconnect applications",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "A Polyakov and T Grob and RA Hovenkamp and HJ Kettelarij and I Eidner and MA Samber and M Bartek and JN Burghartz",
note = "ed. is niet bekend; Electronic Components and Technology (ECTC 2004), 2004 54th Conference, Las Vegas, USA ; Conference date: 01-06-2004 Through 04-06-2004",
year = "2004",
language = "Undefined/Unknown",
isbn = "0-7803-8365-6",
publisher = "IEEE Society",
pages = "1466--1470",
booktitle = "Electronic Components and Technology (ECTC 2004), 2004 54th Conference",
}