Comparison of via-fabrication techniques for through-wafer electrical interconnect applications

A Polyakov, T Grob, RA Hovenkamp, HJ Kettelarij, I Eidner, MA Samber, M Bartek, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    20 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationElectronic Components and Technology (ECTC 2004), 2004 54th Conference
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1466-1470
    Number of pages5
    ISBN (Print)0-7803-8365-6
    Publication statusPublished - 2004
    EventElectronic Components and Technology (ECTC 2004), 2004 54th Conference, Las Vegas, USA - Piscataway
    Duration: 1 Jun 20044 Jun 2004

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceElectronic Components and Technology (ECTC 2004), 2004 54th Conference, Las Vegas, USA
    Period1/06/044/06/04

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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