Comprehensive Material Characterization of Organic Packaging Materials

B Boehme, KMB Jansen, S Rzepka, K-J Wolter

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

9 Citations (Scopus)

Abstract

In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands
Editors Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de
Place of PublicationDelft, The Netherlands
PublisherEuroSimE
Pages289-296
Number of pages8
ISBN (Print)978-1-4244-4159-4
Publication statusPublished - 2009
EventEuroSimE 2009: 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Delft, Netherlands
Duration: 27 Apr 200929 Apr 2009
Conference number: 10

Publication series

Name
PublisherEuroSimE

Conference

ConferenceEuroSimE 2009
Country/TerritoryNetherlands
CityDelft
Period27/04/0929/04/09

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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