Comprehensive Material Characterization of Organic Packaging Materials

B Boehme; KMB Jansen; S Rzepka; K-J Wolter

Comprehensive Material Characterization of Organic Packaging Materials

B Boehme, KMB Jansen, S Rzepka, K-J Wolter

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

10 Citations (Scopus)

Abstract

In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands
Editors	Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de
Place of Publication	Delft, The Netherlands
Publisher	EuroSimE
Pages	289-296
Number of pages	8
ISBN (Print)	978-1-4244-4159-4
Publication status	Published - 2009
Event	EuroSimE 2009: 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Delft, Netherlands Duration: 27 Apr 2009 → 29 Apr 2009 Conference number: 10

Publication series

Name
Publisher	EuroSimE

Conference

Conference	EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	27/04/09 → 29/04/09

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Boehme, B., Jansen, KMB., Rzepka, S., & Wolter, K.-J. (2009). Comprehensive Material Characterization of Organic Packaging Materials. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, & Saint Leger, O de (Eds.), Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands (pp. 289-296). EuroSimE.

Boehme, B ; Jansen, KMB ; Rzepka, S et al. / Comprehensive Material Characterization of Organic Packaging Materials. Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. editor / Ernst, LJ ; Zhang, GQ ; Driel, WD van ; Rodgers, P ; Bailey, C ; Saint Leger, O de. Delft, The Netherlands : EuroSimE, 2009. pp. 289-296

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title = "Comprehensive Material Characterization of Organic Packaging Materials",

abstract = "In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "B Boehme and KMB Jansen and S Rzepka and K-J Wolter",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4159-4",

publisher = "EuroSimE",

pages = "289--296",

editor = "{Ernst, LJ} and {Zhang, GQ} and {Driel, WD van} and {Rodgers, P} and {Bailey, C} and {Saint Leger, O de}",

booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands",

note = "EuroSimE 2009 ; Conference date: 27-04-2009 Through 29-04-2009",

}

Boehme, B, Jansen, KMB, Rzepka, S & Wolter, K-J 2009, Comprehensive Material Characterization of Organic Packaging Materials. in Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds), Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. EuroSimE, Delft, The Netherlands, pp. 289-296, EuroSimE 2009, Delft, Netherlands, 27/04/09.

Comprehensive Material Characterization of Organic Packaging Materials. / Boehme, B; Jansen, KMB; Rzepka, S et al.
Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. ed. / Ernst, LJ; Zhang, GQ; Driel, WD van; Rodgers, P; Bailey, C; Saint Leger, O de. Delft, The Netherlands: EuroSimE, 2009. p. 289-296.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Comprehensive Material Characterization of Organic Packaging Materials

AU - Boehme, B

AU - Jansen, KMB

AU - Rzepka, S

AU - Wolter, K-J

N1 - Conference code: 10

PY - 2009

Y1 - 2009

N2 - In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme.

AB - In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4159-4

SP - 289

EP - 296

BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands

A2 - Ernst, LJ, null

A2 - Zhang, GQ, null

A2 - Driel, WD van, null

A2 - Rodgers, P, null

A2 - Bailey, C, null

A2 - Saint Leger, O de, null

PB - EuroSimE

CY - Delft, The Netherlands

T2 - EuroSimE 2009

Y2 - 27 April 2009 through 29 April 2009

ER -

Boehme B, Jansen KMB, Rzepka S, Wolter KJ. Comprehensive Material Characterization of Organic Packaging Materials. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de, editors, Proceedings of the 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands. Delft, The Netherlands: EuroSimE. 2009. p. 289-296