Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Alexandru Prisacaru; Alicja Palczynska; Przemyslaw Jakub Gromala; Bongtae Han; Guo Qi Zhang

doi:10.1109/ECTC.2017.73

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Jakub Gromala, Bongtae Han, Guo Qi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

10 Citations (Scopus)

53 Downloads (Pure)

Abstract

Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systemsmuch more complex than realized in the past. The automotiveindustry has been forced to adopt advanced consumerelectronics to satisfy the demand, and thus it becomes morechallenging to assess system reliability while adopting the newtechnologies. The system level reliability can be enforced byimplementing a process called condition monitoring. In thispaper, a piezoresistive silicon based stress sensor isimplemented to detect physical damages in outer moldedelectronic control units (ECU) subjected to reliability testingconditions. The test vehicle consists of six DPAK powerpackages and three stress sensors mounted on a PrintedCircuit Board (PCB). A unique algorithm is proposed andimplemented to handle the data obtained from thepiezoresistive stress sensing cells. The accuracy of measureddata is examined by Finite Element method (FEM), and thephysical changes are validated with Scanning AcousticMicroscope (SAM).

Original language	English
Title of host publication	Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1119-1127
Number of pages	9
ISBN (Electronic)	978-1-5090-6315-4
DOIs	https://doi.org/10.1109/ECTC.2017.73
Publication status	Published - Jun 2017
Event	67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States Duration: 30 May 2017 → 2 Jun 2017

Conference

Conference	67th IEEE Electronic Components and Technology Conference, ECTC 2017
Country/Territory	United States
City	Lake Buena Vista
Period	30/05/17 → 2/06/17

Bibliographical note

Accepted author manuscript

Keywords

Condition Monitoring
Electronic Control Units
Fault Detection
Stress Sensor

Access to Document

10.1109/ECTC.2017.73

26111210 - Alexandru_Prisacaru_ECTC_Release_FinalAccepted author manuscript, 1.81 MB

Cite this

@inproceedings{63c5aacc9a5243f5bc0b171958a675cf,

title = "Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units",

abstract = "Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systemsmuch more complex than realized in the past. The automotiveindustry has been forced to adopt advanced consumerelectronics to satisfy the demand, and thus it becomes morechallenging to assess system reliability while adopting the newtechnologies. The system level reliability can be enforced byimplementing a process called condition monitoring. In thispaper, a piezoresistive silicon based stress sensor isimplemented to detect physical damages in outer moldedelectronic control units (ECU) subjected to reliability testingconditions. The test vehicle consists of six DPAK powerpackages and three stress sensors mounted on a PrintedCircuit Board (PCB). A unique algorithm is proposed andimplemented to handle the data obtained from thepiezoresistive stress sensing cells. The accuracy of measureddata is examined by Finite Element method (FEM), and thephysical changes are validated with Scanning AcousticMicroscope (SAM).",

keywords = "Condition Monitoring, Electronic Control Units, Fault Detection, Stress Sensor",

author = "Alexandru Prisacaru and Alicja Palczynska and Gromala, {Przemyslaw Jakub} and Bongtae Han and Zhang, {Guo Qi}",

note = "Accepted author manuscript; 67th IEEE Electronic Components and Technology Conference, ECTC 2017 ; Conference date: 30-05-2017 Through 02-06-2017",

year = "2017",

month = jun,

doi = "10.1109/ECTC.2017.73",

language = "English",

pages = "1119--1127",

booktitle = "Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017",

publisher = "IEEE",

address = "United States",

}

Prisacaru, A, Palczynska, A, Gromala, PJ, Han, B & Zhang, GQ 2017, Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units. in Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017., 7999824, IEEE, Piscataway, NJ, pp. 1119-1127, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, Lake Buena Vista, United States, 30/05/17. https://doi.org/10.1109/ECTC.2017.73

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units. / Prisacaru, Alexandru; Palczynska, Alicja; Gromala, Przemyslaw Jakub et al.
Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, 2017. p. 1119-1127 7999824.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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AU - Palczynska, Alicja

AU - Gromala, Przemyslaw Jakub

AU - Han, Bongtae

AU - Zhang, Guo Qi

N1 - Accepted author manuscript

PY - 2017/6

Y1 - 2017/6

N2 - Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systemsmuch more complex than realized in the past. The automotiveindustry has been forced to adopt advanced consumerelectronics to satisfy the demand, and thus it becomes morechallenging to assess system reliability while adopting the newtechnologies. The system level reliability can be enforced byimplementing a process called condition monitoring. In thispaper, a piezoresistive silicon based stress sensor isimplemented to detect physical damages in outer moldedelectronic control units (ECU) subjected to reliability testingconditions. The test vehicle consists of six DPAK powerpackages and three stress sensors mounted on a PrintedCircuit Board (PCB). A unique algorithm is proposed andimplemented to handle the data obtained from thepiezoresistive stress sensing cells. The accuracy of measureddata is examined by Finite Element method (FEM), and thephysical changes are validated with Scanning AcousticMicroscope (SAM).

AB - Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systemsmuch more complex than realized in the past. The automotiveindustry has been forced to adopt advanced consumerelectronics to satisfy the demand, and thus it becomes morechallenging to assess system reliability while adopting the newtechnologies. The system level reliability can be enforced byimplementing a process called condition monitoring. In thispaper, a piezoresistive silicon based stress sensor isimplemented to detect physical damages in outer moldedelectronic control units (ECU) subjected to reliability testingconditions. The test vehicle consists of six DPAK powerpackages and three stress sensors mounted on a PrintedCircuit Board (PCB). A unique algorithm is proposed andimplemented to handle the data obtained from thepiezoresistive stress sensing cells. The accuracy of measureddata is examined by Finite Element method (FEM), and thephysical changes are validated with Scanning AcousticMicroscope (SAM).

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ER -

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

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Keywords

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