Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model

Jiajie Fan, Tijian Gu, Ping Wang, Wei Cai, Xuejun Fan, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

In high-power electronics packaging, nano-silver sintering technology has been widely applied due to its excellent electrical and thermal conductivity and its low-temperature packaging and high-temperature operation. In this study, 50-nm nano-silver particles are sintered at 275°C for 50 min and placed under a dynamic thermomechanical analyzer (DMA Q800) with three strain rates (0.001%s-1, 0.01%s-1, and 0.1%s-1) and seven ambient temperatures (-40°C, 0°C, 25°C, 60°C, 120°C, 150°C, and 185°C). Both the variable-order fractional constitutive model and Anand model are adopted to characterize the tensile behaviors of sintered nano-silver particles. The results show that (1) the tensile strength of sintered nano-silver particle samples declines under the lower strain rate and higher temperature; and (2) both the variable-order fractional model and Anand model can well represent the tensile mechanical properties of sintered nano-silver. According to the root mean square error (RMSE) calculation, the fitting accuracy of the variable-order fractional model is slightly better than that of the Anand model. Furthermore, the variable-order fractional model involves fewer parameters, which makes it easier to fit than the Anand model.

Original languageEnglish
Title of host publication2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
PublisherIEEE
Pages1-4
Number of pages4
ISBN (Electronic)978-1-6654-1373-2
ISBN (Print)978-1-6654-1374-9
DOIs
Publication statusPublished - 2021
Event22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta
Duration: 19 Apr 202121 Apr 2021

Conference

Conference22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
CountryMalta
CitySt. Julian
Period19/04/2121/04/21

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