Constitutive modelling of the curing process of encapsulate polymers for electronic packages

C van t Hof, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Original languageUndefined/Unknown
Title of host publicationPlastic and viscoplastic response of materials and metal forming
Editors AS Khan, H Zhang, Y Yuan
Place of PublicationFulton
ISBN (Print)0-9659463-2-0
Publication statusPublished - 2000


  • ZX Int.klas.verslagjaar < 2002

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