Constitutive modelling of the curing process of encapsulate polymers for electronic packages

C van t Hof, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

Original language	Undefined/Unknown
Title of host publication	Plastic and viscoplastic response of materials and metal forming
Editors	AS Khan, H Zhang, Y Yuan
Place of Publication	Fulton
Publisher	Neat
Pages	161-163
ISBN (Print)	0-9659463-2-0
Publication status	Published - 2000

Keywords

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title = "Constitutive modelling of the curing process of encapsulate polymers for electronic packages",

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TY - CHAP

T1 - Constitutive modelling of the curing process of encapsulate polymers for electronic packages

AU - van t Hof, C

AU - Ernst, LJ

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Y1 - 2000

KW - ZX Int.klas.verslagjaar < 2002

M3 - Chapter

SN - 0-9659463-2-0

SP - 161

EP - 163

BT - Plastic and viscoplastic response of materials and metal forming

A2 - AS Khan, null

A2 - H Zhang, null

A2 - Y Yuan, null

PB - Neat

CY - Fulton

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