Continuous deep reactive ion etching of tapered via holes for three-dimensional integration

R Li, Y Lamy, WFA Besling, F Roozeboom, PM Sarro

Research output: Contribution to journalArticleScientificpeer-review

Original languageUndefined/Unknown
JournalJournal of Micromechanics and Microengineering
Issue number125023
Publication statusPublished - 2008


  • academic journal papers
  • CWTS 0.75 <= JFIS < 2.00

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