Controlled silicon IC thinning on individual die level for active implant integration using a purely mechanical process

Vasiliki Giagka, Nooshin Saeidi, Andreas Demosthenous, Nick Donaldson

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

5 Citations (Scopus)

Abstract

We are developing an electrode array for epidural spinal cord stimulation and a thin integrated circuit (IC) is to be embedded in it. This paper focuses on the development and characterization of a manual process for thinning individual IC die and discusses the issues associated with thinning small dice by a manual process. The procedure allows easy and controlled post-separation thinning of small (about 1 mm2) silicon chips by grinding. A systematic approach was followed to characterize the technique and repeatability of the results. With the setup we introduced we were able to control the final thickness of the IC with a standard deviation of 9.2 μm. Although no chemical processing is used, a small grit size film can create smooth surfaces, with roughness comparable to reported values after etching, acting as the so-called 'stress-relief' step. Electrical tests performed on a thinned stimulator output stage IC indicated that no die damage was caused by the procedure. Some issues regarding the integration of thinned ICs on flexible substrates and the reliability of gold ball rivet bonds on the ICs' aluminium pads are also discussed.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages2213-2219
Number of pages7
ISBN (Electronic)9781479924073
DOIs
Publication statusPublished - 1 Jan 2014
Externally publishedYes
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 27 May 201430 May 2014

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period27/05/1430/05/14

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