Converter concepts to increase the integration level

J Popovic, JA Ferreira

    Research output: Contribution to journalArticleScientificpeer-review

    17 Citations (Scopus)

    Abstract

    In the previous work, a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts is presented. The quantities intended to evaluate integration level and volumetric utilization in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. A design process in the form of a flow chart that implements these methods in concrete design problems is presented. In this paper, the design process is applied to a dc/dc 42/14-V converter for automotive applications. Utilizing commercially available technologies that lend themselves to mass production this design process results in three packaging concepts, namely lead frame converter, printed circuit board embedded converter, and heat conductor converter. These concepts are then compared to a benchmark converter implemented in the conventional, discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.
    Original languageUndefined/Unknown
    Pages (from-to)558-565
    Number of pages8
    JournalIEEE Transactions on Power Electronics
    Volume20
    Issue number3
    DOIs
    Publication statusPublished - 2005

    Keywords

    • academic journal papers
    • ZX CWTS JFIS < 1.00

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