@inproceedings{58c3d88805234dfe9b12127279d62944,
title = "Copper electroplating for 3D interconnects",
keywords = "Elektrotechniek, Techniek, conference contrib. refereed, Conf.proc. > 3 pag",
author = "M Saadaoui and WHA Wien and {van Zeijl}, HW and PM Sarro",
year = "2006",
language = "Undefined/Unknown",
isbn = "90-73461-44-8",
publisher = "s.l.",
pages = "523--526",
editor = "s.n.",
booktitle = "Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors",
note = "9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands ; Conference date: 23-11-2006 Through 24-11-2006",
}