Cracking prediction of IC's passivation layer using J-integral

GQ Zhang; WD van Driel; XJ Fan; LJ Ernst

Cracking prediction of IC's passivation layer using J-integral

GQ Zhang, WD van Driel, XJ Fan, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	ICEPT 2003
Editors	K Bi, PG Barnwell, J Wang
Place of Publication	Piscataway
Publisher	IEEE
Pages	362-367
Number of pages	6
ISBN (Print)	0-7803-8168-8
Publication status	Published - 2003
Event	5th international conference on electronic packaging technology, Shanghai - Piscataway Duration: 28 Oct 2003 → 30 Oct 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	5th international conference on electronic packaging technology, Shanghai
Period	28/10/03 → 30/10/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{c93b0cdf054c407b983a0f676e72fdfd,

title = "Cracking prediction of IC's passivation layer using J-integral",

keywords = "Conf.proc. > 3 pag",

author = "GQ Zhang and {van Driel}, WD and XJ Fan and LJ Ernst",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-8168-8",

publisher = "IEEE",

pages = "362--367",

editor = "K Bi and PG Barnwell and J Wang",

booktitle = "ICEPT 2003",

address = "United States",

note = "5th international conference on electronic packaging technology, Shanghai ; Conference date: 28-10-2003 Through 30-10-2003",

}

TY - GEN

T1 - Cracking prediction of IC's passivation layer using J-integral

AU - Zhang, GQ

AU - van Driel, WD

AU - Fan, XJ

AU - Ernst, LJ

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8168-8

SP - 362

EP - 367

BT - ICEPT 2003

A2 - Bi, K

A2 - Barnwell, PG

A2 - Wang, J

PB - IEEE

CY - Piscataway

T2 - 5th international conference on electronic packaging technology, Shanghai

Y2 - 28 October 2003 through 30 October 2003

ER -