@inproceedings{1ff92935d28c423b88dbfa671f874630,
title = "Creep behavior of a molding compound and its effect on packaging process stresses",
keywords = "ZX Int.klas.verslagjaar < 2002",
author = "MS Kiasat and G.Q. Zhang and LJ Ernst and G Wisse",
year = "2001",
language = "Undefined/Unknown",
isbn = "0-7803-7038-4",
publisher = "IEEE Society",
pages = "931--938",
editor = "{P Slota Jr.} and {WJ Howell}",
booktitle = "51st electronic components and technology conference, May 26 - June 1",
note = "51st electronic components and tecjnology conference ; Conference date: 26-05-2001 Through 01-06-2001",
}