Creep behavior of a molding compound and its effect on packaging process stresses

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	51st electronic components and technology conference, May 26 - June 1
Editors	P Slota Jr., WJ Howell
Place of Publication	s.l.
Publisher	IEEE
Pages	931-938
Number of pages	8
ISBN (Print)	0-7803-7038-4
Publication status	Published - 2001
Event	51st electronic components and tecjnology conference - s.l. Duration: 26 May 2001 → 1 Jun 2001

Name
Publisher	IEEE

Conference	51st electronic components and tecjnology conference
Period	26/05/01 → 1/06/01

Keywords

@inproceedings{1ff92935d28c423b88dbfa671f874630,

title = "Creep behavior of a molding compound and its effect on packaging process stresses",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "MS Kiasat and G.Q. Zhang and LJ Ernst and G Wisse",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-7038-4",

publisher = "IEEE",

pages = "931--938",

editor = "\{P Slota Jr.\} and \{WJ Howell\}",

booktitle = "51st electronic components and technology conference, May 26 - June 1",

address = "United States",

note = "51st electronic components and tecjnology conference ; Conference date: 26-05-2001 Through 01-06-2001",

}

TY - GEN

T1 - Creep behavior of a molding compound and its effect on packaging process stresses

AU - Kiasat, MS

AU - Zhang, G.Q.

AU - Ernst, LJ

AU - Wisse, G

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-7038-4

SP - 931

EP - 938

BT - 51st electronic components and technology conference, May 26 - June 1

A2 - P Slota Jr., null

A2 - WJ Howell, null

PB - IEEE

CY - s.l.

T2 - 51st electronic components and tecjnology conference

Y2 - 26 May 2001 through 1 June 2001

ER -