Cure dependent characterisation of moulding compounds

KMB Jansen; ML Hawryluk; P Gromala

Cure dependent characterisation of moulding compounds

KMB Jansen, ML Hawryluk, P Gromala

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Abstract

Curing effects and difference in thermal contraction of components cause residual stresses and warpage during encapsulation of electronic packages. Residual stresses combined with thermal and mechanical loads influence package reliability and performance and may eventually lead to product failure. Comprehensive material characterisation is needed in order to perform numerical simulations which take into account the effect of shrinkage and stress development during the curing reaction of the moulding compound. With that, more reliable predictions can be made. The paper deals with detailed characterisation of moulding compounds. These materials show a clear viscoelastic behaviour, which is both temperature and cure dependent. The performed analyses cover cure kinetics, determination of elongation modulus and the studies on viscoelastic behaviour during cure. Furthermore, dilatometric tests were performed to obtain chemical shrinkage, bulk modulus and to check its time dependency. The obtained parameters including cure shrinkage will be implemented in the finite element software (ANSYS) using user programmable subroutines and APDL code.

Original language	English
Title of host publication	Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria
Editors	LJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger
Place of Publication	Linz, Austria
Publisher	IEEE Society
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4577-0105-4
Publication status	Published - 2011
Event	EuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 Conference number: 12

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2011
Country/Territory	Austria
City	Linz
Period	18/04/11 → 20/04/11

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Jansen, KMB., Hawryluk, ML., & Gromala, P. (2011). Cure dependent characterisation of moulding compounds. In LJ. Ernst, GQ. Zhang, WD. V. Driel, P. Rodgers, C. Bailey, & O. D. Saint Leger (Eds.), Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria (pp. 1-6). IEEE Society.

Jansen, KMB ; Hawryluk, ML ; Gromala, P. / Cure dependent characterisation of moulding compounds. Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. editor / LJ Ernst ; GQ Zhang ; WD van Driel ; P Rodgers ; C Bailey ; O de Saint Leger. Linz, Austria : IEEE Society, 2011. pp. 1-6

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title = "Cure dependent characterisation of moulding compounds",

abstract = "Curing effects and difference in thermal contraction of components cause residual stresses and warpage during encapsulation of electronic packages. Residual stresses combined with thermal and mechanical loads influence package reliability and performance and may eventually lead to product failure. Comprehensive material characterisation is needed in order to perform numerical simulations which take into account the effect of shrinkage and stress development during the curing reaction of the moulding compound. With that, more reliable predictions can be made. The paper deals with detailed characterisation of moulding compounds. These materials show a clear viscoelastic behaviour, which is both temperature and cure dependent. The performed analyses cover cure kinetics, determination of elongation modulus and the studies on viscoelastic behaviour during cure. Furthermore, dilatometric tests were performed to obtain chemical shrinkage, bulk modulus and to check its time dependency. The obtained parameters including cure shrinkage will be implemented in the finite element software (ANSYS) using user programmable subroutines and APDL code.",

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author = "KMB Jansen and ML Hawryluk and P Gromala",

year = "2011",

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booktitle = "Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria",

note = "EuroSimE 2011 : 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 18-04-2011 Through 20-04-2011",

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Jansen, KMB, Hawryluk, ML & Gromala, P 2011, Cure dependent characterisation of moulding compounds. in LJ Ernst, GQ Zhang, WDV Driel, P Rodgers, C Bailey & OD Saint Leger (eds), Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. IEEE Society, Linz, Austria, pp. 1-6, EuroSimE 2011, Linz, Austria, 18/04/11.

Cure dependent characterisation of moulding compounds. / Jansen, KMB; Hawryluk, ML; Gromala, P.
Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. ed. / LJ Ernst; GQ Zhang; WD van Driel; P Rodgers; C Bailey; O de Saint Leger. Linz, Austria: IEEE Society, 2011. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Cure dependent characterisation of moulding compounds

AU - Jansen, KMB

AU - Hawryluk, ML

AU - Gromala, P

N1 - Conference code: 12

PY - 2011

Y1 - 2011

N2 - Curing effects and difference in thermal contraction of components cause residual stresses and warpage during encapsulation of electronic packages. Residual stresses combined with thermal and mechanical loads influence package reliability and performance and may eventually lead to product failure. Comprehensive material characterisation is needed in order to perform numerical simulations which take into account the effect of shrinkage and stress development during the curing reaction of the moulding compound. With that, more reliable predictions can be made. The paper deals with detailed characterisation of moulding compounds. These materials show a clear viscoelastic behaviour, which is both temperature and cure dependent. The performed analyses cover cure kinetics, determination of elongation modulus and the studies on viscoelastic behaviour during cure. Furthermore, dilatometric tests were performed to obtain chemical shrinkage, bulk modulus and to check its time dependency. The obtained parameters including cure shrinkage will be implemented in the finite element software (ANSYS) using user programmable subroutines and APDL code.

AB - Curing effects and difference in thermal contraction of components cause residual stresses and warpage during encapsulation of electronic packages. Residual stresses combined with thermal and mechanical loads influence package reliability and performance and may eventually lead to product failure. Comprehensive material characterisation is needed in order to perform numerical simulations which take into account the effect of shrinkage and stress development during the curing reaction of the moulding compound. With that, more reliable predictions can be made. The paper deals with detailed characterisation of moulding compounds. These materials show a clear viscoelastic behaviour, which is both temperature and cure dependent. The performed analyses cover cure kinetics, determination of elongation modulus and the studies on viscoelastic behaviour during cure. Furthermore, dilatometric tests were performed to obtain chemical shrinkage, bulk modulus and to check its time dependency. The obtained parameters including cure shrinkage will be implemented in the finite element software (ANSYS) using user programmable subroutines and APDL code.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://www.eurosime.org

M3 - Conference contribution

SN - 978-1-4577-0105-4

SP - 1

EP - 6

BT - Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Driel, WD van

A2 - Rodgers, P

A2 - Bailey, C

A2 - Saint Leger, O de

PB - IEEE Society

CY - Linz, Austria

T2 - EuroSimE 2011

Y2 - 18 April 2011 through 20 April 2011

ER -

Jansen KMB, Hawryluk ML, Gromala P. Cure dependent characterisation of moulding compounds. In Ernst LJ, Zhang GQ, Driel WDV, Rodgers P, Bailey C, Saint Leger OD, editors, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Linz, Austria: IEEE Society. 2011. p. 1-6

Cure dependent characterisation of moulding compounds

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Keywords

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