Cure, temperature and time dependent constitutive of moulding compounds

KMB Jansen, L WANG, C van t Hof, LJ Ernst, HJL Bressers, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
EditorsLJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages581-585
Number of pages5
ISBN (Print)0-7803-8420-2
Publication statusPublished - 2004
EventEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium
Duration: 10 May 200412 May 2004

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
CountryBelgium
CityBrussels
Period10/05/0412/05/04

Keywords

  • Conf.proc. > 3 pag

Cite this

Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL., & Zhang, GQ. (2004). Cure, temperature and time dependent constitutive of moulding compounds. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Saint Leger (Eds.), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (pp. 581-585). IEEE Society.