Cure, temperature and time dependent constitutive of moulding compounds

KMB Jansen; L WANG; C van t Hof; LJ Ernst; HJL Bressers; GQ Zhang

Cure, temperature and time dependent constitutive of moulding compounds

KMB Jansen, L WANG, C van t Hof, LJ Ernst, HJL Bressers, GQ Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	581-585
Number of pages	5
ISBN (Print)	0-7803-8420-2
Publication status	Published - 2004
Event	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

Bibliographical note

IEEE Cat No. 04EX831

Keywords

Conf.proc. > 3 pag

Cite this

Jansen, KMB., WANG, L., van t Hof, C., Ernst, LJ., Bressers, HJL., & Zhang, GQ. (2004). Cure, temperature and time dependent constitutive of moulding compounds. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Saint Leger (Eds.), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (pp. 581-585). IEEE.

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author = "KMB Jansen and L WANG and {van t Hof}, C and LJ Ernst and HJL Bressers and GQ Zhang",

note = "IEEE Cat No. 04EX831; EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 10-05-2004 Through 12-05-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8420-2",

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Jansen, KMB, WANG, L, van t Hof, C, Ernst, LJ, Bressers, HJL & Zhang, GQ 2004, Cure, temperature and time dependent constitutive of moulding compounds. in LJ Ernst, GQ Zhang, P Rodgers & O de Saint Leger (eds), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. IEEE, Piscataway, pp. 581-585, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Brussels, Belgium, 10/05/04.

Cure, temperature and time dependent constitutive of moulding compounds. / Jansen, KMB; WANG, L; van t Hof, C et al.
EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; P Rodgers; O de Saint Leger. Piscataway: IEEE, 2004. p. 581-585.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Cure, temperature and time dependent constitutive of moulding compounds

AU - Jansen, KMB

AU - WANG, L

AU - van t Hof, C

AU - Ernst, LJ

AU - Bressers, HJL

AU - Zhang, GQ

N1 - IEEE Cat No. 04EX831

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8420-2

SP - 581

EP - 585

BT - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 10 May 2004 through 12 May 2004

ER -

Jansen KMB, WANG L, van t Hof C, Ernst LJ, Bressers HJL, Zhang GQ. Cure, temperature and time dependent constitutive of moulding compounds. In Ernst LJ, Zhang GQ, Rodgers P, de Saint Leger O, editors, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Piscataway: IEEE. 2004. p. 581-585