Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

J Tang, EGJ Reinders, CTA Revenberg, JBJ Schelen, CIM Beenakker

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 2012 IEEE 14th Electronics Packaging Technology Conference
EditorsN Khan, A Anand, A Yeo
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages165-169
Number of pages5
ISBN (Print)978¿1¿4673¿4551¿4
DOIs
Publication statusPublished - 2012
Event2012 IEEE EPTC, Singapore - Piscataway, NJ, USA
Duration: 1 Dec 20127 Dec 2012

Publication series

Name
PublisherIEEE

Conference

Conference2012 IEEE EPTC, Singapore
Period1/12/127/12/12

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