@inproceedings{08d7c4f25ba64dac978521dd58e71d0d,
title = "Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma",
author = "J Tang and EGJ Reinders and CTA Revenberg and JBJ Schelen and CIM Beenakker",
year = "2012",
doi = "10.1109/EPTC.2012.6507071",
language = "English",
isbn = "978¿1¿4673¿4551¿4",
publisher = "IEEE Society",
pages = "165--169",
editor = "N Khan and A Anand and A Yeo",
booktitle = "Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference",
note = "2012 IEEE EPTC, Singapore ; Conference date: 01-12-2012 Through 07-12-2012",
}