Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

J Tang; EGJ Reinders; CTA Revenberg; JBJ Schelen; CIM Beenakker

doi:10.1109/EPTC.2012.6507071

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

J Tang
, EGJ Reinders
, CTA Revenberg
, JBJ Schelen
, CIM Beenakker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

8 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference
Editors	N Khan, A Anand, A Yeo
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	165-169
Number of pages	5
ISBN (Print)	978¿1¿4673¿4551¿4
DOIs	https://doi.org/10.1109/EPTC.2012.6507071
Publication status	Published - 2012
Event	2012 IEEE EPTC, Singapore - Piscataway, NJ, USA Duration: 1 Dec 2012 → 7 Dec 2012

Publication series

Name
Publisher	IEEE

Conference

Conference	2012 IEEE EPTC, Singapore
Period	1/12/12 → 7/12/12

Access to Document

10.1109/EPTC.2012.6507071

Cite this

Tang, J., Reinders, EGJ., Revenberg, CTA., Schelen, JBJ., & Beenakker, CIM. (2012). Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma. In N. Khan, A. Anand, & A. Yeo (Eds.), Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference (pp. 165-169). IEEE. https://doi.org/10.1109/EPTC.2012.6507071

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title = "Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma",

author = "J Tang and EGJ Reinders and CTA Revenberg and JBJ Schelen and CIM Beenakker",

year = "2012",

doi = "10.1109/EPTC.2012.6507071",

language = "English",

isbn = "978¿1¿4673¿4551¿4",

publisher = "IEEE",

pages = "165--169",

editor = "N Khan and A Anand and A Yeo",

booktitle = "Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference",

address = "United States",

note = "2012 IEEE EPTC, Singapore ; Conference date: 01-12-2012 Through 07-12-2012",

}

Tang, J, Reinders, EGJ, Revenberg, CTA, Schelen, JBJ & Beenakker, CIM 2012, Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma. in N Khan, A Anand & A Yeo (eds), Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference. IEEE, Piscataway, NJ, USA, pp. 165-169, 2012 IEEE EPTC, Singapore, 1/12/12. https://doi.org/10.1109/EPTC.2012.6507071

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma. / Tang, J; Reinders, EGJ; Revenberg, CTA et al.
Proceedings 2012 IEEE 14th Electronics Packaging Technology Conference. ed. / N Khan; A Anand; A Yeo. Piscataway, NJ, USA: IEEE, 2012. p. 165-169.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

AU - Tang, J

AU - Reinders, EGJ

AU - Revenberg, CTA

AU - Schelen, JBJ

AU - Beenakker, CIM

PY - 2012

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A2 - Anand, A

A2 - Yeo, A

PB - IEEE

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Y2 - 1 December 2012 through 7 December 2012

ER -