Deep reactive ion etching in through-silicon via technology

F Roozeboom, MA Blauw, Y Lamy, E van Grunsven, W Dekkers, JF Verhoeven, F van den Heuvel, EWJM van der Drift, WMM Kessels, MCM van de Sanden

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Original languageUndefined/Unknown
Title of host publication3D interconnect and packaging technology
EditorsPE Garrou, P Ramm, CA Bower
Place of PublicationNew York
PublisherJohn Wiley & Sons
Pages47-91
Number of pages298
ISBN (Print)978-3-527-32034-9
Publication statusPublished - 2007

Bibliographical note

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Keywords

  • authored books
  • Boekdeel internat.wet

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