Delamination modeling of three-dimensional microelectronic systems

O van der Sluis, PHM Timmermans, RBR van Silfhout, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

3 Citations (Scopus)

Abstract

Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. Numerical modeling can provide more fundamental understanding of these failure phenomena. As a result, predicting and ultimately preventing these phenomena will result in an increased reliability of current and future electronic products. In this paper, delamination phenomena occuring in Cu/low-k back-end structures, buckling-driven delamination in flexible electronics and peeling tests on stretchable electronics will be modeled and validated by experimental results. For the Cu/low-k back-end structues, failure sensitivity analysis is performed by the recently developed Area Release Energy (ARE) method while transient delamination processes are described by cohesive zone elements in the critical regions. For the latter, a dedicated solver is applied that is able to deal with brittle interfaces. For the flexible and stretchable electronics applications, cohesive zones are used to characterize the interface properties by combining numerical results with experimental measurements.
Original languageUndefined/Unknown
Title of host publication2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Editors Wipiejewski, T., Trewhella, J.
Place of PublicationOrlando, FL, USA
PublisherIEEE Society
Pages1593-1600
Number of pages8
ISBN (Print)978-1-4244-2231-9
Publication statusPublished - 2008
Event58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA
Duration: 27 May 200830 May 2008

Publication series

Name
PublisherIEEE

Conference

Conference58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period27/05/0830/05/08

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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