Delamination Toughness of Cu-EMC Interfaces at Harsh Environment

Keyphrases

• Delamination Toughness 100%
• Harsh Environment 100%
• Interfacial Fracture Toughness 66%
• Pressure Cooker 33%
• Laminated Structure 33%
• Microelectronics Industry 33%
• High Pressure 33%
• Environmental Temperature 33%
• Toughness Index 33%
• Interfacial Delamination 33%
• Mode Mixing 33%
• Pressure Chamber 33%
• Mixed Mode Bending 33%
• Combined Mode 33%
• Moisture 33%
• Copper Leadframe 33%
• Bi-material 33%
• Initial Stress 33%
• Real Production 33%
• Pressure Vessel 33%
• Mechanical Loading 33%

INIS

• interfaces 100%
• environment 100%
• rhodium 100 66%
• molding 33%
• production 33%
• levels 33%
• epoxides 33%
• moisture 33%
• bending 33%
• reliability 33%
• microelectronics 33%
• industry 33%
• loading 33%
• pressure vessels 33%
• high pressure 33%
• copper compounds 33%
• cracks 33%

Engineering

• Environment 100%
• Delamination 100%
• Temperature 40%
• Mechanical Loading 20%
• Molding 20%
• Measurement 20%
• Mixed-Mode Bending 20%
• Production Process 20%
• Chamber Pressure 20%
• Stress State 20%
• High Pressure 20%
• Pressure Vessel 20%
• Mode Mixity 20%
• Reliability Issue 20%
• Lead Frame 20%
• Microelectronics 20%
• Environment Temperature 20%
• Pressure Cooker 20%
• Crack 20%