Design 3D printed coils for WPT

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

The geometric shapes of coils influence the performance of a 3D IPT system. In this paper, we proposed a 3D coil design method based on (3D) printing electronics. Given a 3D transmitter coil, the center position of the receiver coil is estimated as a random seed position in the corresponding 3D surface first. At this position, we use the heatmap method with electromagnetic constraints to iteratively extend the coil until the desired power can be transferred via the coil. For each extension of the coil, i.e. a new turn, the shape of the coil is optimized by calculating the convex hull of the new turn in the 2D projection plane. Using this method, we are able to generate a receiver coil to transmit “just enough” power at a given seed position. Then, by fixing the receiver coil, the 3D shape of the transmitter coil can be optimized as well. This zig-zag optimization process iterates until there are few changes of the position and 3D shapes in the iteration. Experiment results with Ansys Maxwell verified the effectiveness of the proposed 3D coil design method, and highlighted possible future research directions as well.

Original languageEnglish
Title of host publication41st Computers and Information in Engineering Conference (CIE)
PublisherThe American Society of Mechanical Engineers(ASME)
ISBN (Electronic)978-0-7918-8537-6
DOIs
Publication statusPublished - 2021
Event41st Computers and Information in Engineering Conference, CIE 2021, Held as Part of the ASME 2021 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC-CIE 2021 - Virtual, Online
Duration: 17 Aug 202119 Aug 2021

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume2

Conference

Conference41st Computers and Information in Engineering Conference, CIE 2021, Held as Part of the ASME 2021 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC-CIE 2021
CityVirtual, Online
Period17/08/2119/08/21

Keywords

  • 3D printed electronics

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