Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

Romina Sattari; Henk van Zeijl; Guoqi  Zhang

doi:10.1109/EPTC59621.2023.10457675

Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

Romina Sattari^*, Henk van Zeijl, Guoqi Zhang

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely etched away in narrower areas providing semi-floating metal fingers. Therefore, after wafer molding, the packaging encapsulation material such as the epoxy molding compound covers larger area around the electrodes and increases the sensitivity by confining more of the electrical field lines. The results confirm the enhanced sensitivity of the proposed humidity sensor for characterization and monitoring of the aging properties of packaging encapsulation materials.

Original language	English
Title of host publication	Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
Editors	Andrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin
Publisher	IEEE
Pages	588-591
Number of pages	4
ISBN (Electronic)	979-8-3503-2957-5
ISBN (Print)	979-8-3503-2958-2
DOIs	https://doi.org/10.1109/EPTC59621.2023.10457675
Publication status	Published - 2023
Event	2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore Duration: 5 Dec 2023 → 8 Dec 2023 Conference number: 25

Publication series

Name	Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

Conference

Conference	2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
Country/Territory	Singapore
City	Singapore
Period	5/12/23 → 8/12/23

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Encapsulation
Electrodes
Sensitivity
Manufacturing processes
Fingers
Humidity
Reliability engineering

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10.1109/EPTC59621.2023.10457675

Design_and_Manufacturing_of_an_In-Package_Relative_Humidity_Sensor_with_Multi-Width_Interdigital_Electrodes_Towards_Enhanced_Sensitivity_for_Characterization_of_Packaging_Encapsulation_MaterialsFinal published version, 3.31 MB

Cite this

Sattari, R., van Zeijl, H., & Zhang, G. (2023). Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials. In A. Tay, K. J. Chui, Y. K. Lim, C. S. Tan, & S. Shin (Eds.), Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 (pp. 588-591). (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023). IEEE. https://doi.org/10.1109/EPTC59621.2023.10457675

Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi . / Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials. Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. editor / Andrew Tay ; King Jien Chui ; Yeow Kheng Lim ; Chuan Seng Tan ; Sunmi Shin. IEEE, 2023. pp. 588-591 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).

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title = "Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials",

abstract = "This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely etched away in narrower areas providing semi-floating metal fingers. Therefore, after wafer molding, the packaging encapsulation material such as the epoxy molding compound covers larger area around the electrodes and increases the sensitivity by confining more of the electrical field lines. The results confirm the enhanced sensitivity of the proposed humidity sensor for characterization and monitoring of the aging properties of packaging encapsulation materials.",

keywords = "Encapsulation, Electrodes, Sensitivity, Manufacturing processes, Fingers, Humidity, Reliability engineering",

author = "Romina Sattari and {van Zeijl}, Henk and Guoqi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ; Conference date: 05-12-2023 Through 08-12-2023",

year = "2023",

doi = "10.1109/EPTC59621.2023.10457675",

language = "English",

isbn = "979-8-3503-2958-2",

series = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",

publisher = "IEEE",

pages = "588--591",

editor = "Andrew Tay and Chui, {King Jien} and Lim, {Yeow Kheng} and Tan, {Chuan Seng} and Sunmi Shin",

booktitle = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",

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}

Sattari, R , van Zeijl, H & Zhang, G 2023, Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials. in A Tay, KJ Chui, YK Lim, CS Tan & S Shin (eds), Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, IEEE, pp. 588-591, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, Singapore, 5/12/23. https://doi.org/10.1109/EPTC59621.2023.10457675

Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials. / Sattari, Romina ; van Zeijl, Henk ; Zhang, Guoqi .
Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. ed. / Andrew Tay; King Jien Chui; Yeow Kheng Lim; Chuan Seng Tan; Sunmi Shin. IEEE, 2023. p. 588-591 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

AU - Sattari, Romina

AU - van Zeijl, Henk

AU - Zhang, Guoqi

N1 - Conference code: 25

PY - 2023

Y1 - 2023

N2 - This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely etched away in narrower areas providing semi-floating metal fingers. Therefore, after wafer molding, the packaging encapsulation material such as the epoxy molding compound covers larger area around the electrodes and increases the sensitivity by confining more of the electrical field lines. The results confirm the enhanced sensitivity of the proposed humidity sensor for characterization and monitoring of the aging properties of packaging encapsulation materials.

AB - This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely etched away in narrower areas providing semi-floating metal fingers. Therefore, after wafer molding, the packaging encapsulation material such as the epoxy molding compound covers larger area around the electrodes and increases the sensitivity by confining more of the electrical field lines. The results confirm the enhanced sensitivity of the proposed humidity sensor for characterization and monitoring of the aging properties of packaging encapsulation materials.

KW - Encapsulation

KW - Electrodes

KW - Sensitivity

KW - Manufacturing processes

KW - Fingers

KW - Humidity

KW - Reliability engineering

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DO - 10.1109/EPTC59621.2023.10457675

M3 - Conference contribution

SN - 979-8-3503-2958-2

T3 - Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

SP - 588

EP - 591

BT - Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

A2 - Tay, Andrew

A2 - Chui, King Jien

A2 - Lim, Yeow Kheng

A2 - Tan, Chuan Seng

A2 - Shin, Sunmi

PB - IEEE

T2 - 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

Y2 - 5 December 2023 through 8 December 2023

ER -

Sattari R , van Zeijl H , Zhang G. Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials. In Tay A, Chui KJ, Lim YK, Tan CS, Shin S, editors, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. IEEE. 2023. p. 588-591. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023). doi: 10.1109/EPTC59621.2023.10457675

Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

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Bibliographical note

Keywords

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