Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench

JFC van Gurp; M Tichem; U Staufer

doi:10.1007/978-3-642-28163-1_3

Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench

Micro and Nano Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar
Editors	S Ratchev
Place of Publication	Berlin-Heidelberg
Publisher	Springer
Pages	17-27
Number of pages	11
ISBN (Print)	978-3-642-28162-4
DOIs	https://doi.org/10.1007/978-3-642-28163-1_3
Publication status	Published - 2012
Event	6th IFIP WG 5.5 Seminar - IPAS 2012, Chamonix, France - Berlin-Heidelberg Duration: 12 Feb 2012 → 15 Feb 2012

Publication series

Name
Publisher	Springer verlag

Name	IFIP Advances in Information and Communication Technologies
Volume	371
ISSN (Print)	1868-4238

Conference

Conference	6th IFIP WG 5.5 Seminar - IPAS 2012, Chamonix, France
Period	12/02/12 → 15/02/12

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Access to Document

10.1007/978-3-642-28163-1_3

Cite this

van Gurp, JFC., Tichem, M., & Staufer, U. (2012). Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench. In S. Ratchev (Ed.), Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar (pp. 17-27). (IFIP Advances in Information and Communication Technologies; Vol. 371). Springer. https://doi.org/10.1007/978-3-642-28163-1_3

van Gurp, JFC ; Tichem, M ; Staufer, U. / Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench. Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar. editor / S Ratchev. Berlin-Heidelberg : Springer, 2012. pp. 17-27 (IFIP Advances in Information and Communication Technologies).

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title = "Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{van Gurp}, JFC and M Tichem and U Staufer",

year = "2012",

doi = "10.1007/978-3-642-28163-1_3",

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isbn = "978-3-642-28162-4",

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pages = "17--27",

editor = "S Ratchev",

booktitle = "Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar",

note = "6th IFIP WG 5.5 Seminar - IPAS 2012, Chamonix, France ; Conference date: 12-02-2012 Through 15-02-2012",

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van Gurp, JFC, Tichem, M & Staufer, U 2012, Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench. in S Ratchev (ed.), Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar. IFIP Advances in Information and Communication Technologies, vol. 371, Springer, Berlin-Heidelberg, pp. 17-27, 6th IFIP WG 5.5 Seminar - IPAS 2012, Chamonix, France, 12/02/12. https://doi.org/10.1007/978-3-642-28163-1_3

Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench. / van Gurp, JFC; Tichem, M ; Staufer, U.
Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar. ed. / S Ratchev. Berlin-Heidelberg: Springer, 2012. p. 17-27 (IFIP Advances in Information and Communication Technologies; Vol. 371).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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AU - Tichem, M

AU - Staufer, U

PY - 2012

Y1 - 2012

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

U2 - 10.1007/978-3-642-28163-1_3

DO - 10.1007/978-3-642-28163-1_3

M3 - Conference contribution

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BT - Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar

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PB - Springer

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T2 - 6th IFIP WG 5.5 Seminar - IPAS 2012, Chamonix, France

Y2 - 12 February 2012 through 15 February 2012

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van Gurp JFC, Tichem M , Staufer U. Design, fabrication and testing of assembly features for enabling sub-micron accurate passive alignment of photonic chips on a silicon optical bench. In Ratchev S, editor, Precision Assembly Technology & Systems- Proceedings 6th IFIP WG 5.5 International Precision Assembly Seminar. Berlin-Heidelberg: Springer. 2012. p. 17-27. (IFIP Advances in Information and Communication Technologies). doi: 10.1007/978-3-642-28163-1_3