Design for Reliability of Wafer Level Packages

WD van Driel, HP Hochstenbach, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006
Editors Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., Saint Leger, O. de
Place of PublicationComo, Italy
PublisherEuroSimE
Pages1-5
Number of pages5
ISBN (Print)1-4244-0276X
Publication statusPublished - 2006
EventEuroSimE 2006: 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy
Duration: 24 Apr 200626 Apr 2006
Conference number: 7

Publication series

Name
PublisherEuroSimE

Conference

ConferenceEuroSimE 2006
CountryItaly
CityComo
Period24/04/0626/04/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this

van Driel, WD., Hochstenbach, HP., & Zhang, GQ. (2006). Design for Reliability of Wafer Level Packages. In Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M., & Saint Leger, O. de (Eds.), Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006 (pp. 1-5). EuroSimE.