INIS
adhesives
12%
bending
50%
capacity
12%
capture
12%
comparative evaluations
12%
computerized simulation
12%
copper
37%
dies
100%
finite element method
12%
geometry
12%
heat dissipation
12%
increasing
12%
industry
12%
information
12%
interfaces
100%
length
12%
microelectronics
12%
modeling
100%
moisture
25%
optical systems
12%
packaging
12%
sensitivity analysis
12%
silver
12%
temperature dependence
100%
temperature range 0273-0400 k
50%
thermal conduction
12%
values
12%
zones
100%
Engineering
Cohesive Zone
100%
Computer Simulation
11%
Delamination
100%
Element Model
11%
Elements
11%
Experiments
22%
Finite Element Method
11%
Heat Conduction
11%
Heat Losses
11%
Horizontal Direction
11%
Increasing Temperature
11%
Large Effect
11%
Microelectronics
11%
Model Parameter
11%
Optical Systems
11%
Point Bending Test
44%
Property Characterization
100%
Sensitivity Study
11%
Test System
11%
Transients
11%