| Original language | English |
|---|---|
| IPC | H01L |
| Priority date | 11/07/23 |
| Publication status | Published - 2025 |
Bibliographical note
Patent:OCT-22-037Applicant: TU Delft
Applicant: TU Delft
Direct bonding of diamond on a deposited insulating layer
R. Ishihara (Inventor), S. Nur (Inventor)
Research output: Patent
Applicant: TU Delft