DRIE and bonding assisted low cost MEMS processing of inplane HAR inertial sensors

V Rajaraman, KAA Makinwa, PJ French

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

3 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of ASDAM 2008
Editors s.n.
Place of Publicationslovakia
PublisherASDAM
Pages327-330
Number of pages4
ISBN (Print)978-1-4244-2325-5
Publication statusPublished - 2008
EventIEEE conference on Advanced semiconductor devices and microsystems (ASDAM 2008), smolenice,slovakia - slovakia
Duration: 12 Oct 200816 Oct 2008

Publication series

Name
PublisherASDAM

Conference

ConferenceIEEE conference on Advanced semiconductor devices and microsystems (ASDAM 2008), smolenice,slovakia
Period12/10/0816/10/08

Keywords

  • Elektrotechniek
  • Techniek
  • conference contrib. non-refer.
  • Conf.proc. > 3 pag

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