Dry self-alignment for batch-assembly of chips

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proc. of Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009
Editors	s.n.
Place of Publication	Denver, US
Publisher	IEEE
Pages	212-215
Number of pages	4
ISBN (Print)	978-1-4244-4193-8
Publication status	Published - 2009
Event	The 15th Int. Conf. on Solid-State Sensors, Actuators & Microsystems - Denver, US Duration: 21 Jun 2009 → 25 Jun 2009

Name
Publisher	IEEE

Conference	The 15th Int. Conf. on Solid-State Sensors, Actuators & Microsystems
Period	21/06/09 → 25/06/09

Keywords

@inproceedings{6b351e2df504439db8ea7e38660d1def,

title = "Dry self-alignment for batch-assembly of chips",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "I Kurniawan and M Tichem and U Staufer",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4193-8",

publisher = "IEEE",

pages = "212--215",

editor = "s.n.",

booktitle = "Proc. of Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009",

address = "United States",

note = "The 15th Int. Conf. on Solid-State Sensors, Actuators & Microsystems ; Conference date: 21-06-2009 Through 25-06-2009",

}

TY - GEN

T1 - Dry self-alignment for batch-assembly of chips

AU - Kurniawan, I

AU - Tichem, M

AU - Staufer, U

PY - 2009

Y1 - 2009

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4193-8

SP - 212

EP - 215

BT - Proc. of Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009

A2 - s.n., null

PB - IEEE

CY - Denver, US

T2 - The 15th Int. Conf. on Solid-State Sensors, Actuators & Microsystems

Y2 - 21 June 2009 through 25 June 2009

ER -