Effect of chip anisotropy on packaging process induced stresses

JHJ Janssen; DG Yang; LJ Ernst; ? et al

Effect of chip anisotropy on packaging process induced stresses

JHJ Janssen, DG Yang, LJ Ernst, ? et al

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11
Editors	LJ Ernst, de O Saint Leger, GQ Zhang
Place of Publication	Paris
Publisher	Europia
Pages	83-88
Number of pages	6
ISBN (Print)	07803-9806-8
Publication status	Published - 2001
Event	EuroSimE 2001 - Paris, France Duration: 9 Apr 2001 → 11 Apr 2001

Publication series

Name
Publisher	Europia

Conference

Conference	EuroSimE 2001
Country/Territory	France
City	Paris
Period	9/04/01 → 11/04/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{1070e3bd98784b4eb027153f6a1fc6ec,

title = "Effect of chip anisotropy on packaging process induced stresses",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "JHJ Janssen and DG Yang and LJ Ernst and {et al}, ?",

year = "2001",

language = "Undefined/Unknown",

isbn = "07803-9806-8",

publisher = "Europia",

pages = "83--88",

editor = "{LJ Ernst} and {O Saint Leger}, de and {GQ Zhang}",

booktitle = "Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11",

note = "EuroSimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",

}

Effect of chip anisotropy on packaging process induced stresses. / Janssen, JHJ; Yang, DG; Ernst, LJ et al.
Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. ed. / LJ Ernst; de O Saint Leger; GQ Zhang. Paris: Europia, 2001. p. 83-88.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Effect of chip anisotropy on packaging process induced stresses

AU - Janssen, JHJ

AU - Yang, DG

AU - Ernst, LJ

AU - et al, ?

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 07803-9806-8

SP - 83

EP - 88

BT - Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11

A2 - LJ Ernst, null

A2 - O Saint Leger, de

A2 - GQ Zhang, null

PB - Europia

CY - Paris

T2 - EuroSimE 2001

Y2 - 9 April 2001 through 11 April 2001

ER -