Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

RBR van Silfhout; WD van Driel; Y. Li; MAJ van Gils; JHJ Jansen; GQ Zhang; G Tao; J Bisschop; LJ Ernst

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

RBR van Silfhout, WD van Driel, Y. Li, MAJ van Gils, JHJ Jansen, GQ Zhang, G Tao, J Bisschop, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

10 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	69-74
Number of pages	6
ISBN (Print)	0-7803-8420-2
Publication status	Published - 2004
Event	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

Bibliographical note

IEEE Cat No. 04EX831

Keywords

Conf.proc. > 3 pag

Cite this

van Silfhout, RBR., van Driel, WD., Li, Y., van Gils, MAJ., Jansen, JHJ., Zhang, GQ., Tao, G., Bisschop, J., & Ernst, LJ. (2004). Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Saint Leger (Eds.), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (pp. 69-74). IEEE.

van Silfhout, RBR ; van Driel, WD ; Li, Y. et al. / Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques. EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. editor / LJ Ernst ; GQ Zhang ; P Rodgers ; O de Saint Leger. Piscataway : IEEE, 2004. pp. 69-74

@inproceedings{94fbb58bd4b34762bbe4b5b3259ec929,

title = "Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques",

keywords = "Conf.proc. > 3 pag",

author = "{van Silfhout}, RBR and {van Driel}, WD and Y. Li and {van Gils}, MAJ and JHJ Jansen and GQ Zhang and G Tao and J Bisschop and LJ Ernst",

note = "IEEE Cat No. 04EX831; EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 10-05-2004 Through 12-05-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8420-2",

publisher = "IEEE",

pages = "69--74",

editor = "LJ Ernst and GQ Zhang and P Rodgers and {de Saint Leger}, O",

booktitle = "EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems",

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van Silfhout, RBR, van Driel, WD, Li, Y, van Gils, MAJ, Jansen, JHJ, Zhang, GQ, Tao, G, Bisschop, J & Ernst, LJ 2004, Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques. in LJ Ernst, GQ Zhang, P Rodgers & O de Saint Leger (eds), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. IEEE, Piscataway, pp. 69-74, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Brussels, Belgium, 10/05/04.

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques. / van Silfhout, RBR; van Driel, WD; Li, Y. et al.
EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; P Rodgers; O de Saint Leger. Piscataway: IEEE, 2004. p. 69-74.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

AU - van Silfhout, RBR

AU - van Driel, WD

AU - Li, Y.

AU - van Gils, MAJ

AU - Jansen, JHJ

AU - Zhang, GQ

AU - Tao, G

AU - Bisschop, J

AU - Ernst, LJ

N1 - IEEE Cat No. 04EX831

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8420-2

SP - 69

EP - 74

BT - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 10 May 2004 through 12 May 2004

ER -

van Silfhout RBR, van Driel WD, Li Y, van Gils MAJ, Jansen JHJ, Zhang GQ et al. Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques. In Ernst LJ, Zhang GQ, Rodgers P, de Saint Leger O, editors, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Piscataway: IEEE. 2004. p. 69-74