@inproceedings{2028f464e34e406ca3af02c79bbdb1d1,
title = "Effect of Package Type in IC-Package Stress Interaction Design Rules",
abstract = "In this paper, virtual prototyping is used to generate more accurate and efficient stress design rules for IC backend structures, in combination with packaging processes and geometry. The addressed failure mode is passivation cracks and depending on the package type or family this failure mode is easier to occur. A series of experiments are conducted to prove the effect of the package type on this IC failure mode. It is demonstrated that for successful development of IC backend structures and processes, it is essential to take into account the influence of the package in the earlier phase of IC backend development. The so-called integral design rules, accounting for all the major loading sources and history of the complete product creation process has to be used for the development of new generation semiconductors devices.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{van Driel}, WD and D Yang and GQ Zhang",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2127-5",
publisher = "EuroSimE",
pages = "27--30",
editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Saint Leger, O. de}",
booktitle = "Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems",
note = "9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Conference date: 21-04-2008 Through 23-04-2008",
}