@inproceedings{16bdf0f424d14f33bcbea44ea44e9a45,
title = "Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect",
abstract = "In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the passivation layer. One-dimensional (1D) analytical solution for the passivated conductor is obtained. The numerical results show that the conductor covered with the stiffer passivation layer has much less EM damage. And the steady-state solution shows that the magnitude of (jL)c increases with increasing Young's modulus of passivation material. The present study provides a way to predict the EM performances taking into account various passivation materials. ",
keywords = "coupling theory, electromigration, Eshelby's solution, passivation",
author = "Zhen Cui and Xuejun Fan and Guoqi Zhang",
note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 ; Conference date: 30-05-2023 Through 02-06-2023",
year = "2023",
doi = "10.1109/ECTC51909.2023.00226",
language = "English",
isbn = "979-8-3503-3499-9",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",
pages = "1327--1331",
booktitle = "Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)",
address = "United States",
}