TY - JOUR
T1 - Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints
AU - Liu, Yang
AU - Ren, Boqiao
AU - Zhou, Min
AU - Xue, Yuxiong
AU - Zeng, Xianghua
AU - Sun, Fenglian
AU - Fan, Xuejun
AU - Zhang, Guoqi
PY - 2020
Y1 - 2020
N2 - The effects of porous copper (P-Cu) on the microstructure, hardness, and shear strength of SnBi, SnBi-0.4Ag, and SnBi-1Ag solder joints were investigated in this paper. The experimental results show that P-Cu frames distribute in the solder bulks and form triangular areas. The addition of P-Cu leads to the microstructural refinement in the enclosed areas by the P-Cu frames in the solder bulks. The average hardness here is increased due to the fine grain strengthening mechanism. The SnBi-1Ag@P-Cu solder bulk shows smaller Bi-rich grains but larger β-Sn dendrites than the other two P-Cu-enhanced solder bulks. Porous Cu exists as a frame structure in the solder joints, which hinders the initiation and propagation of cracks and has a positive effect on the improvement of joint strength. Compared to the SnBi and SnBiAg solder joints, the shear strength of the P-Cu-enhanced solder joints is increased by 15%. The average shear strength of the SnBi-0.4Ag@P-Cu solder joint is 79.34 MPa, which is the highest among all the solder joints investigated in this study.
AB - The effects of porous copper (P-Cu) on the microstructure, hardness, and shear strength of SnBi, SnBi-0.4Ag, and SnBi-1Ag solder joints were investigated in this paper. The experimental results show that P-Cu frames distribute in the solder bulks and form triangular areas. The addition of P-Cu leads to the microstructural refinement in the enclosed areas by the P-Cu frames in the solder bulks. The average hardness here is increased due to the fine grain strengthening mechanism. The SnBi-1Ag@P-Cu solder bulk shows smaller Bi-rich grains but larger β-Sn dendrites than the other two P-Cu-enhanced solder bulks. Porous Cu exists as a frame structure in the solder joints, which hinders the initiation and propagation of cracks and has a positive effect on the improvement of joint strength. Compared to the SnBi and SnBiAg solder joints, the shear strength of the P-Cu-enhanced solder joints is increased by 15%. The average shear strength of the SnBi-0.4Ag@P-Cu solder joint is 79.34 MPa, which is the highest among all the solder joints investigated in this study.
KW - Hardness
KW - Microstructure
KW - Porous Cu
KW - Shear behavior
KW - SnBi
UR - http://www.scopus.com/inward/record.url?scp=85089830400&partnerID=8YFLogxK
U2 - 10.1007/s00339-020-03926-3
DO - 10.1007/s00339-020-03926-3
M3 - Article
AN - SCOPUS:85089830400
SN - 0947-8396
VL - 126
SP - 1
EP - 10
JO - Applied Physics A: Materials Science and Processing
JF - Applied Physics A: Materials Science and Processing
IS - 9
M1 - 735
ER -