@inproceedings{655597d1c26f43249fe9b85390b287d3,
title = "Effect of pressure on nano copper sintering in interconnections of power device",
abstract = "As the next-generation solder, nano-copper paste has attracted wide attention in the field of power electronics due to its outstanding properties. In this paper, the effect of pressure on nano-copper sintering is investigated. It is found that the electrode of chip cannot be contacted to the nano-copper layer when no pressure is applied, whereas during the sintering there are fewer defects on the surface of nano-copper compared with that of pre-sintering under certain pressure conditions. Besides, the results of metallographic microscope confirm that the sintering quality of nano-copper has a positive relationship with pressure.",
keywords = "Nano-copper, Power electronics, Pressure, Sintering",
author = "Jing Qian and Xianping Chen and Chunjian Tan and Xiandong Li and Qiumei Li and Luqi Tao and Yiping Huang and Lingmei Wu",
year = "2019",
doi = "10.1109/ICEPT47577.2019.245788",
language = "English",
series = "2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019",
publisher = "IEEE",
booktitle = "2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019",
address = "United States",
note = "20th International Conference on Electronic Packaging Technology, ICEPT 2019 ; Conference date: 12-08-2019 Through 15-08-2019",
}