Effects of Molding Compound Cure on Warpage of Electronic Packages

J de Vreugd; KMB Jansen; LJ Ernst; C Bohm; A Kessler; H Preu

Effects of Molding Compound Cure on Warpage of Electronic Packages

J de Vreugd, KMB Jansen, LJ Ernst, C Bohm, A Kessler, H Preu

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

15 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings EPTC 2008
Editors	R Lee
Place of Publication	Singapore
Publisher	IEEE
Pages	675-682
Number of pages	8
ISBN (Print)	978-1-4244-2117-9
Publication status	Published - 2008
Event	Electronic Packaging Technology Conference - Singapore Duration: 9 Dec 2008 → 12 Dec 2008

Publication series

Name
Publisher	IEEE

Conference

Conference	Electronic Packaging Technology Conference
Period	9/12/08 → 12/12/08

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{a0ee08324fcd412bbe85a8c8c51cfb99,

title = "Effects of Molding Compound Cure on Warpage of Electronic Packages",

keywords = "Conf.proc. > 3 pag",

author = "{de Vreugd}, J and KMB Jansen and LJ Ernst and C Bohm and A Kessler and H Preu",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2117-9",

publisher = "IEEE",

pages = "675--682",

editor = "R Lee",

booktitle = "Proceedings EPTC 2008",

address = "United States",

note = "Electronic Packaging Technology Conference ; Conference date: 09-12-2008 Through 12-12-2008",

}

TY - GEN

T1 - Effects of Molding Compound Cure on Warpage of Electronic Packages

AU - de Vreugd, J

AU - Jansen, KMB

AU - Ernst, LJ

AU - Bohm, C

AU - Kessler, A

AU - Preu, H

PY - 2008

Y1 - 2008

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2117-9

SP - 675

EP - 682

BT - Proceedings EPTC 2008

A2 - Lee, R

PB - IEEE

CY - Singapore

T2 - Electronic Packaging Technology Conference

Y2 - 9 December 2008 through 12 December 2008

ER -