Effects of Molding Compound Cure on Warpage of Electronic Packages

J de Vreugd, KMB Jansen, LJ Ernst, C Bohm, A Kessler, H Preu

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

12 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings EPTC 2008
EditorsR Lee
Place of PublicationSingapore
PublisherIEEE Society
Pages675-682
Number of pages8
ISBN (Print)978-1-4244-2117-9
Publication statusPublished - 2008
EventElectronic Packaging Technology Conference - Singapore
Duration: 9 Dec 200812 Dec 2008

Publication series

Name
PublisherIEEE

Conference

ConferenceElectronic Packaging Technology Conference
Period9/12/0812/12/08

Keywords

  • Conf.proc. > 3 pag

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