Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

YT He, F Li, WF He, J Hui, GQ Zhang, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationAdvances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology)
EditorsYS Luo, Q Rao, Y Xu
Place of PublicationNew York
PublisherScience Press USA inc
Number of pages4
Publication statusPublished - 2005
Event4th Pacific Rim Conference on Rheology, Shanghai, China - New York
Duration: 7 Aug 200511 Aug 2005

Publication series

PublisherScience Press USA Inc.


Conference4th Pacific Rim Conference on Rheology, Shanghai, China


  • Conf.proc. > 3 pag

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