Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

P Lin, GQ Zhang, HW van Zeijl, BH Lian, Y Wang, QB Yao

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)
Original languageEnglish
Pages (from-to)22-26
Number of pages5
JournalMicroelectronic Engineering
Publication statusPublished - 2015

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