| Original language | English |
|---|---|
| Pages (from-to) | 1279-1284 |
| Number of pages | 6 |
| Journal | Microelectronics Reliability |
| Volume | 52 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2012 |
Bibliographical note
harvestBetreft: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011), Linz, Austria