Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder

Shuang Zhang; Yang Liu; Hao Zhang; Min Zhou; Yuxiong Xue; Xianghua Zeng; Rongxing Cao; Penghui Chen

doi:10.1080/09507116.2021.1913451

Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder

Shuang Zhang, Yang Liu^*, Hao Zhang, Min Zhou, Yuxiong Xue, Xianghua Zeng, Rongxing Cao, Penghui Chen

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

Abstract

Sn-Ag-x solders were used as the interfacial layers between SnBi solder and Cu substrate. The effects of Sn-Ag-x layers on the solderability, microstructure, and mechanical properties of SnBi solder joint were investigated. Experimental results indicate that all the barrier layers have positive effects on improving the wettability of SnBi solder. The relative area and grain size of β-Sn was enlarged due to the addition of Sn-Ag-x layers. Meanwhile, the addition of the interfacial layers decreased the hardness of the SnBi solder joint. The addition of Sn-Ag-x layers increased the thickness of the interfacial intermetallic compound (IMC) but had limited effects on the shear force of the SnBi solder joint. Due to the addition of the interfacial layers, the brittleness of the SnBi/Cu solder joints during the shear test was slightly suppressed.

Original language	English
Pages (from-to)	16-23
Number of pages	8
Journal	Welding International
Volume	35
Issue number	1-3
DOIs	https://doi.org/10.1080/09507116.2021.1913451
Publication status	Published - 2021

Keywords

hardness
Interfacial layers
microstructure
shear behaviour
SnBi

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10.1080/09507116.2021.1913451

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title = "Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder",

abstract = "Sn-Ag-x solders were used as the interfacial layers between SnBi solder and Cu substrate. The effects of Sn-Ag-x layers on the solderability, microstructure, and mechanical properties of SnBi solder joint were investigated. Experimental results indicate that all the barrier layers have positive effects on improving the wettability of SnBi solder. The relative area and grain size of β-Sn was enlarged due to the addition of Sn-Ag-x layers. Meanwhile, the addition of the interfacial layers decreased the hardness of the SnBi solder joint. The addition of Sn-Ag-x layers increased the thickness of the interfacial intermetallic compound (IMC) but had limited effects on the shear force of the SnBi solder joint. Due to the addition of the interfacial layers, the brittleness of the SnBi/Cu solder joints during the shear test was slightly suppressed.",

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author = "Shuang Zhang and Yang Liu and Hao Zhang and Min Zhou and Yuxiong Xue and Xianghua Zeng and Rongxing Cao and Penghui Chen",

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T1 - Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder

AU - Zhang, Shuang

AU - Liu, Yang

AU - Zhang, Hao

AU - Zhou, Min

AU - Xue, Yuxiong

AU - Zeng, Xianghua

AU - Cao, Rongxing

AU - Chen, Penghui

PY - 2021

Y1 - 2021

N2 - Sn-Ag-x solders were used as the interfacial layers between SnBi solder and Cu substrate. The effects of Sn-Ag-x layers on the solderability, microstructure, and mechanical properties of SnBi solder joint were investigated. Experimental results indicate that all the barrier layers have positive effects on improving the wettability of SnBi solder. The relative area and grain size of β-Sn was enlarged due to the addition of Sn-Ag-x layers. Meanwhile, the addition of the interfacial layers decreased the hardness of the SnBi solder joint. The addition of Sn-Ag-x layers increased the thickness of the interfacial intermetallic compound (IMC) but had limited effects on the shear force of the SnBi solder joint. Due to the addition of the interfacial layers, the brittleness of the SnBi/Cu solder joints during the shear test was slightly suppressed.

AB - Sn-Ag-x solders were used as the interfacial layers between SnBi solder and Cu substrate. The effects of Sn-Ag-x layers on the solderability, microstructure, and mechanical properties of SnBi solder joint were investigated. Experimental results indicate that all the barrier layers have positive effects on improving the wettability of SnBi solder. The relative area and grain size of β-Sn was enlarged due to the addition of Sn-Ag-x layers. Meanwhile, the addition of the interfacial layers decreased the hardness of the SnBi solder joint. The addition of Sn-Ag-x layers increased the thickness of the interfacial intermetallic compound (IMC) but had limited effects on the shear force of the SnBi solder joint. Due to the addition of the interfacial layers, the brittleness of the SnBi/Cu solder joints during the shear test was slightly suppressed.

KW - hardness

KW - Interfacial layers

KW - microstructure

KW - shear behaviour

KW - SnBi

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DO - 10.1080/09507116.2021.1913451

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JO - Welding International

JF - Welding International

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ER -

Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder

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Keywords

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